• Downsizing package
• Higher density with stacked layer
• Variety of device combination (SiP)
VT-X700 / VT-X900
產品特色
Omron‘s unique Automated inspection capability ensures process quality in a mass-production environment by using Submicron CT imaging with a variety of Metrology data.
Trends
Technology
Omron’s proven 3D-CT technology leads through
- Fast and Quantitative metrology
- Stable Imaging with Sub-Micron Magnification
- Recipe-based Automated Inspection
Automated Inspection and Metrology in mass production environment
Application
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Hardware configuration/function specifications
| Item | Description | ||
|---|---|---|---|
| Model | VT-X700-M | VT-X900 | |
| Imaging method | Parallel CT, 3D slice imaging | ||
| Imaging resolution | 10, 15, 20, 25, 30 μm | 0.3, 0.5, 0.7, 1.0, 2.0, 3.0 μm | |
| Max. Inspection area | 330 mm x 255 mm | 330 mm x 330 mm | |
| Imaging device |
Source | 110 kV closed tube | 110 kV open tube |
| Detector | 5M pixels flat panel detector | 4M pixels I.I. camera | |
| Tool specification |
Dimension | 1,550(W) x 1,650(D) x 1,620(H) mm | 2,271(W) x 1,707(D) x 1,889(H) mm |
| Weight | Approx. 2,900 kg | Approx. 3,300 kg | |
| Rated voltage | Single phase 200/210/220/230/240 VAC (±10%) | Single phase 200/208/220/230/240 VAC (±10%) | |
| Rated power | 2.9 kVA | 6.0 kVA | |
| Oil free air | 0.4 to 0.6 MPa | 0.4 to 0.6 MPa | |
| X-Ray leakage | < 0.5 μSv/hr | < 0.5 μSv/hr | |
| Standard | CE, SEMI S2/S8, SECS/GEM, NFPA79, FDA | ||
*The specification subject to change without notice.
（單位：mm）
VT-X700-M
VT-X900
English
Global Edition
| Catalog Name | Catalog Number [size] |
Last Update | |
|---|---|---|---|
 VT-X700 / VT-X900 Catalog |
Q326-E1-02 [2777KB] |
May 09, 2016
20160509
|
VT-X700 / VT-X900 Catalog |